CAE Analysis (Thermal and Stress Analysis)

You see a medical specialist when you’re sick
Your products also deserve expert care!

WTI Thermal & Stress Clinic

WTI Thermal and Stress ClinicBring your products in for a “checkup” to diagnose the cause of any heat and stress-related design issues. Our thermal and stress analysis specialists will give you a “prescription” to prevent any future problems.

Examples of how WTI can help:

One of your developed or mass-produced products is defective, and you need the problem fixed ASAP. WTI’s thermal and stress analysis “doctors” (specialists) identify the cause of the defect, “prescribe” a solution, and you are able to deal with the problem in very little time.

The solutions which WTI specialists “prescribe” are extremely dependable. Whereas other methods rely solely on extensions of past designs, or human intuition, WTI specialists utilize one-of-a-kind WTI technology and their own analytical techniques, honed from years of experience, to provide accurate solutions for clients’ needs.

This allows clients to troubleshoot in a short amount of time. Countless clients indeed report that they were able to shorten the amount of time spent on troubleshooting.

And, by using this service before trial production, clients can identify effective prevention methods in advance. This means that heat and stress problems are completely prevented before any occur.

Prevention is the best cure: By following prescribed preventative measures from the start, clients can avoid many problems, such as last-minute development problems, emergency redesigns, and the time loss that results from these unpleasant surprises.

< WTI heat and stress clinic > is recommended for such peopleOur WTI Thermal & Stress Clinic is perfect for clients who:

  • Have sudden issues with developed or mass-produced products, and need to know the cause and a solution immediately.
  • Plan to begin development and want to know design guidelines in advance to prevent any trouble when proceeding with development (improvement of product life, drop impact resistance, vibration resistance, etc.)
  • Want to determine whether heat dissipation measures are necessary, and if so, what measures are available.
  • Want to know the thermal resistance of high accuracy semiconductors.

-> Logical analysis via CAE (Computer Aided Engineering) can be the key to solving these issues.

However, in order to solve problems with CAE, it is not enough to have the necessary mastery of simulation tools. It is also essential to have the technology and skills to have an accurate and high correlation with the actual product. Building this technology anew requires a considerable amount of time. And, simulation tools are not something which can simply be implemented and used immediately. Specialized knowledge and skills, in material mechanics, analytical theory, strength evaluation, and on-site evaluation experience, are needed to properly utilize these tools.

That is why it is recommended businesses outsource to a design company which has built-up an abundance of such technologies and skills over the years.


Wave Technology Inc. (WTI) Simulation Services
(Click the links below for more information.)

Heat Conduction & Thermal Fluid Analysis Structural & Stress Analysis
Heat conduction / thermal fluid analysis Structural / stress analysis


WTI analysis and simulation technology can be described as follows:

  1. WTI is a company involved in design, development, and prototyping, and our decades of hands-on experience means we already understand products before we even analyze them. We have successfully reduced the number of prototype tests for actual clients by understanding actual objects before providing analysis results.

  2. WTI has all the thermal, structural and electrical analysis technologies one must consider when creating new products. Requesting every different simulation from a different analysis company can be a hassle. WTI, on the other hand, combines these different technologies to provide solutions tailored to each client’s development situation and needs.

  3. Semiconductor components are vital heat source parameters in thermal analysis. In order to accurately reflect this heat transfer characteristic in the analysis, it is essential to have the technical ability to understand semiconductor element structure and reflect this understanding in thermal resistance calculations.

    If not sufficiently accurate, the accuracy of the entire thermal simulation will become greatly reduced, and it will be difficult to reduce the number of prototypes. At WTI, we have developed our very own semiconductor thermal resistance measurement technology based on the structure and thermal characteristics of semiconductors.


WTI provides high-precision analysis and simulation services using the technologies above. Our services have been praised highly by customers from a variety of backgrounds, including corporations, universities, and public research institutions.

We offer thorough and courteous support services for analysis methods, whether it be proposing methods, solving problems with analysis, or anything in between. Contact us today with any questions.


Heat conduction and thermal fluid analysis

As the package size of semiconductor components becomes smaller, the heat density of chips (the heat source) tends to continue to increase. In addition, the decrease in heat dissipation area due to the increase in the density of components inside the electronic equipment housing is a factor which further increases the thermal severity. All too often, problems arise where the temperature measurement after prototyping suddenly shows the component operating temperature exceeds the maximum rating. And when this unpleasant surprise happens, you’re left scrambling to come up with countermeasures, ASAP.

In heat dissipation design, it is important to perform simulation verification at each stage of concept design, basic design, detailed design, and prototype production. The earlier the stage of design, the more flexibility there is in making adjustments. As the mass production stage approaches, this freedom decreases. (Implementing thermal countermeasures becomes exceedingly difficult as mass production nears, and the cost of such measures increases significantly. In some cases, a redesign with new component placement may even be necessary.) WTI offers analysis services for your needs, whether that be analyzing a portion of the process, or analyzing the entire development process.

How easy it is to modify heat radiation design in each phase of product development[Degree of freedom in heat radiation design in each phase of product development]

Concept design You can get by with Excel-level rough calculations. However, by performing a proper analysis at this stage, and appropriately choosing the direction you want development to take, the subsequent stages of design become easier to manage.
Basic design Calculations can be made with a simple model which assumes the print circuit board generates heat uniformly. Then, the structure of the housing, or board— created with heat dissipation path in mind— can be examined.
Detailed design Printed circuit boards can be analyzed in detail from an individual heat generation model, which is regarded as each component that generates heat uniformly. Heat dissipation measures, including component placement, can then be studied.
Prototyping WTI will also model the internal structure of components, measure the actual temperature, and then perform a detailed analysis in which we even match the absolute values of the actual measurement and the simulation.


Fields of experience

We have experience with electrics and electronics (including semiconductors), in-vehicle equipment, power supply equipment, solar power generation equipment, medical equipment, engine parts, air conditioning equipment, communications equipment, and more.

Analysis examples

  • Heat dissipation measures via thermal fluid analysis
  • Sound suppression design
    Wind path design, designed with optimal fan pressure loss in mind
  • High-accuracy, high-precision temperature measurement (Thermal resistance measurement technology for semiconductor packages)
    Method and apparatus for measuring thermal resistance in semiconductor devices (patent number 5232289)


Structural and stress analysis

Different product categories pose different structural challenges.

Reliability required of products

[Reliability required for products]

For in-vehicle electronic devices, communication devices, and power supply devices that require a longer life,

WTI proposes measures based on thermal stress analysis (fatigue life prediction), which considers thermal fatigue due to temperature changes (temperature cycle tests).

Today, various types of housings—from mobile terminals to outdoor electrical equipment—are being made thinner and lighter.
Unfortunately, thinner, lighter weights result in decreased housing strength. There are also concerns of deformation and breakage due to shock and vibration. WTI employs structural and stress analysis to verify strength and safety, and then proposes countermeasures for these issues.

For industrial sensor devices and in-vehicle electronic devices that require vibration resistance and quietness, we conduct structural studies based on analysis which considers the natural value and response of vibration, and spectral response analysis.

Analysis examples

  • Prediction and improvement of life time via temperature cycle test
  • Drop and shock countermeasures
  • Housing strength verification and countermeasures for manufacturing and transport
  • Structure and material analysis
    Structural analysis of semiconductor package (X-ray, cross section polishing, SEM, etc.)
    Physical property measurement (linear expansion coefficient, elastic modulus, tensile strength)


Links to other WTI pages

  • Heat dissipation measures using thermo-fluid analysis
  • High-accuracy temperature measurement (semiconductor package thermal resistance measurement technology)
  • Visit the WTI blog for more information:
    No more heat margin for the product? How a knowledge of semiconductors is key to making accurate predictions
    Thermal stress generated by temperature change is greater than you’d imagine
    Reliability evaluations for mounted semiconductor packages (Daisy chain samples to identify breakage points)
    Case design: the feedback destination of simulation results
    Avoid those heat problems with preventive diagnosis!


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