Are your packing materials suitable for transportation? Keys to evaluation of packing materials for semiconductor products

Hello, everyone. I’m Sasatani with the package design section of the Tokyo office.

Packing materials for semiconductor products need to be designed to ensure that the products can be properly protected against vibration, shock and compression pressure during transportation, and to be evaluated by performance test. In this article, we will introduce a technique to evaluate whether the packaging materials are properly designed.



1. Evaluation for possible transportation stress

You first determine the expected level of vibration during transport (Table 1) and perform randomized vibration tests (Table 2) depending on the level.


(1) Vibration in transportation packing materials receives


Table 1. Expected level of vibration during transportation


Short distance
(≤ 200 km)

Long distance

(≥ 2500 km)

Good transportation infrastructure

Poor transportation infrastructure

Domestic transport

Level 3

Level 1

Level 3

Overseas transport

Level 1

Level 2

Level 1

(Severity: Level 1 > Level 2 > Level 3)


Table 2. Conditions for randomized vibration test

Test Time


Level 1

Level 2

Level 3

Time (min.)

180 90 15

Acceleration Power Spectral Density


For all levels

Hz (m/s2)2/Hz , (g2/Hz)a)
3 0.048 , (0.0005)
6 1.15 , (0.012)
18 1.15 , (0.012)
40 0.096 , (0.001)
200 0.048 , (0.0005)

Effective acceleration value :5.8 m/s2 [0.59 ga)]

Note a)  g=9.806 658 m/s2


(2) Drop impact at transportation / transshipment

Assume the impact of transshipment to and from trucks, ships, freight cars, or transshipment across carriers during the transportation process.
Then you can determine the drop height of the free fall test from the assumed level and the total package mass. (Table 3)

Level I: When transshipment frequency is high and very large external forces are expected to be applied.

Level Ⅱ: When transshipment frequency is high and relatively large external forces are expected to be applied.

Level III: When transshipment frequency and magnitude of external force applied are expected as normal.

Level IV: When transshipment frequency is low and there is no risk of significant external force.


Table 3. Drop height (free fall test)

Total package mass
Drop height (cm)
Level I Level II Level III Level IV
              <10 80 60 40 30
 10≤      <20 60 55 35 25
 20≤      <30 50 45 30 20
 30≤      <40 40 35 25 15
 40≤      <50 30 25 20 10
 50≤      <100 25 20 15 10

 (Severity: Level Ⅰ > Level Ⅱ > Level Ⅲ > Level Ⅳ)



2. Packing Boxes Strength Evaluation

To perform a quantitative strength evaluation, determine the conditions of the evaluation test in accordance with JIS Z0212:1998 (Packaged freights and containers — Method of compression test).

For the compression test, apply pressure to the boxes at a constant velocity across the boxes with parallel plates. The boxes under pressure will not crumble until it exceeds their load capacity, but once it exceeds the limit, they lose repulsive force and begin to crumble. Compression testing allows you to observe how the boxes crumble evenly or unevenly, so you can determine if your designed boxes have the desired strength (i.e., load-bearing capacity) from the appearance of the beginning of crumbling and the result of maximum load.

If you have multiple factories producing the same product, the packing box materials and specifications that differ from one manufacturer to another. In case you standardize packing boxes, it is unthinkable to manage materials and specifications that differ from one manufacturer to another.
Since packing boxes materials and specifications vary from region to region and country to country, strength comparisons in compression tests are a useful evaluation method.

A lot of WTI’s experience in packing materials design for semiconductor products and evaluation of them allows us to offer you a suitable packing materials design. If you have any problems with packing materials for semiconductor products, please feel free to contact us.


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